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| Chemicals > Electroplating Chemicals > Additives for Acid Copper Baths > Leveller > RALU®PLATE 2887 |
RALU®PLATE 2887
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LCD booster and leveller for the acid copper bath RALU®PLATE 2887 is an aqueous solution of a crosslinked polyamide with amine functions. RALU®PLATE 2887 improves in the acid copper bath the deposition in the low current densities and the levelling. RALU®PLATE 2887 is mainly used in baths for electronic parts but could also be used in decorative baths. RALU®PLATE 2887 is usually combined with polyethylene glycols, non ionic surfactants and sulphur compounds. |
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| Dr. Ferdinand Leifeld Phone: +49 621 5618 369 Fax: +49 621 5618 661 Email: Click to contact |
